Department Elektrotechnik-Elektronik-Informationstechnik (EEI)


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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

From
To

Abstract

Journal

Validating a battery fault model for synthetic fault data generation for lithium-ion battery systems (2026) Reiter A, Rosenmüller C, Lehner S, Sauer DU, Bohlen O Journal article, Original article Disparity Estimation of Planar Reflective Surfaces Using Specular Reflections From a Single Light Source (2026) Kossira K, Sippel F, Seiler J, Kaup A Journal article Parallel Context Modeling for Sliding Window Attention in Neural Video Coding (2026) Kopte A, Kaup A Conference contribution, Conference Contribution Analysis of Neural Network-based Predictors for Predictive SAR ADC Applications (2026) Spielberger A, Spitzkopf L, Pfannenmüller C, Schrotz AM, Weigel R, Franchi N Conference contribution, Conference Contribution Convex Design of Higher Order Allpass Transformed DCT Filter Banks with Perfect and Near-Perfect Reconstruction (2026) Löllmann H, Kaup A Conference contribution, Conference Contribution Capsule-based combinatorial study of solubility, transport and crystallization for ammonothermal synthesis of piezoelectric and ferroelectric ternary nitrides (2026) Geng C, Wostatek T, Zenk M, Friedrich J, Schimmel S Conference contribution, Abstract of lecture Investigating failure mechanisms in DC hybrid switchgear through a methodical evaluation of critical faults (2026) Bernhardt A, Streck M, Gehring J, Schuster J, Kaiser J, Kraus M, Oehler C, et al. Journal article High-Fidelity Near-Field mmWave MIMO Radar Simulation via Polarized Path Tracing (2026) Hofmann N, Wirth V, Gutsche F, Ullmann I, Weyrich T, Vossiek M, Stamminger M Journal article Frequency–spatial decoupled co-modeling transformer for fine-grained remote sensing image segmentation (2026) Li X, Qian S, Lyu X, Song Y, Liu F, Fang Y, Xu Z, Kaup A Journal article Capillary-assisted automated silver direct bond of chip-on-chip through a novel sponge-dipping approach (2026) Weber J, Rauh H, Leib J, März M Journal article