Department Maschinenbau


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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

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To

Abstract

Journal

Analysing the Scope of Technical Due Diligence in the Context of Mergers and Acquisitions (2024) Trauner V, Hilbrand P, Franke J Conference contribution, Conference Contribution 3D Body Twin: Improving Human Gait Visualizations Using Personalized Avatars (2024) Zieger D, Güthlein F, Henningson JO, Jakob V, Gaßner H, Shanbhag J, Fleischmann S, et al. Conference contribution Additive manufacturing of polyamide 12 bulk structures using directed energy deposition with a thulium laser: Effect of process conditions on morphology and mechanical performance (2024) Wittmann A, Meth C, Alidoust Chamandani S, Vetter J, Kopp SP, Schmidt M Journal article Ti3C2Tx-UHMWPE nanocomposites—Towards an enhanced wear-resistance of biomedical implants (2024) Rothammer B, Feile K, Werner S, Frank R, Bartz M, Wartzack S, Schubert DW, et al. Journal article, Original article Comparative Study of Keypoint Detection and ArUco Marker Methods for Optical 6D Pose Estimation in Electronics Packaging (2024) Janisch L, Schulz D, Schmidt A, Kamps T, Reisch R, Franke J Conference contribution Interlayer-free laser coating of AISI H11 tool steel for H11/Cu composite material (2024) Vetter J, Hentschel O, Chechik L, Schmidt M Journal article Biotribological investigation of amorphous carbon coatings in hard-on-soft contact for biomedical applications (2024) Rothammer B, Neusser K, Bartz M, Wartzack S, Marian M Conference contribution, Conference Contribution Influence of Different Filler Systems on the Thermal Conductivity and Mechanical Properties of Thermosets (2024) Rösel U, Drummer D Journal article Editorial: Human digital twins for medical and product engineering (2024) Miehling J, Choisne J, Koelewijn A Journal article Data-Driven Bed of Nails Wear Analysis for the in-Circuit-Testing of Electronic Modules (2024) Sindel T, Thielen N, Mahr F, Reichenstein T, Erdogan H, Franke J Conference contribution