Department Maschinenbau

Long-term electromigration study of lead-free flip-chips with solder bumps with 50 μm or 60 μm diameter employing ENIG surface finish on both chip and substrate side (2013) Gorywoda M, Dohle R, Härter S, Wirth A, Goßler J, Franke J Conference contribution Cutting-edge engineering - An innovative approach to better support the engineering and the life cycle of automated production systems (2013) Merhof J, Franke J Conference contribution Energy-efficient production strategies and technologies for electric drives (2013) Franke J, Kreitlein S, Risch F, Günther S Conference contribution Closed-loop control of patient handling robots (2013) Ziegler C, Franke J Conference contribution Lean information management of manual assembly processes: Creating it-based information systems for assembly staff simultaneous to the product engineering process (2013) Lušić M, Hornfeck R, Fischer C, Franke J Conference contribution The LinKin System: A new robotic and universally applicable radiation therapy device (2013) Ziegler C, Franke J Conference contribution Hall measurement method for the detection of material defects in plastic-embedded permanent magnets of rotors (2013) Brela M, Michalski M, Gebhardt HJ, Franke J Conference contribution Electrical functionalization of thermoplastic materials by cold active atmospheric plasma technology (2013) Schramm R, Franke J Conference contribution Characterizing the placement accuracy of a handling unit used for assembling 3D circuit carriers (2013) Pfeffer M, Franke J Conference contribution Disassembly, recycling, and reuse of magnet material of electric drives (2013) Klier T, Risch F, Franke J Conference contribution