Lehrstuhl für Hochfrequenztechnik (LHFT)


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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

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Abstract

Journal

Investigation of the effects of energy density in Laser Sintering of polypropylene on morphological and dielectric properties for high-frequency antennas (2024) Romeis M, Ehrngruber M, Drummer D Conference contribution UAV Formation Optimization for Communication-Assisted InSAR Sensing (2024) Lahmeri MA, Mustieles Perez V, Vossiek M, Krieger G, Schober R Conference contribution, Original article Water-soluble filament in multifilament approach for ultrasound phantom fabrication (2024) Huber C, Lahmadi W, Alballa A, Heim C, Rupitsch SJ, Ermert H, Ullmann I, Lyer S Journal article A Joint Radar and Communication Approach Based on Phase-Coded FMCW Chirp Sequences (2024) Alami El Dine M, Stelzig M, Schür J, Vossiek M Conference contribution Assessment of OFDM Radar in Automotive and Joint Communication and Sensing Scenarios using Realistic Ray Tracing Simulations (2024) Noegel T, Sura O, Schüßler C, Hoffmann M, Vossiek M Conference contribution Joint Transmit Signal and Beamforming Design for Integrated Sensing and Power Transfer Systems (2024) Mayer K, Shanin N, You Z, Lotter S, Brückner S, Vossiek M, Cottatellucci L, Schober R Conference contribution Efficient Synthesis of Broadband Linear Frequency-Modulated Quadrature Signals for Coherent Electro-Optical Sensor Systems (2024) Schmidt M, Carlowitz C Conference contribution Modelling and Construction of Complex Shaped Polyvinyl Alcohol based Ultrasound Phantoms for Inverse Magnetomotive Ultrasound Imaging (2024) Heim C, Huber C, Ermert H, Ullmann I, Saleem T, Lyer S, Rupitsch SJ Conference contribution, Conference Contribution Magnetically Enhanced Ultrasound Strain Elastography to Visualize Magnetic Nanoparticles (2024) Huber C, Müller MS, Ermert H, Heim C, Rupitsch SJ, Ullmann I, Lyer S Conference contribution, Conference Contribution A Foil Flip-Chip Interconnect With an Ultra-Broadband Bandwidth of 130 GHz and Beyond for Heterogeneous High-End System Designs (2024) Pfahler T, Scheder A, Bridier A, Nagel M, Vossiek M Journal article