Rohde & Schwarz GmbH & Co. KG

German Perspective on 6G – Use Cases, Technical Building Blocks and Requirements Insights by the 6G Platform Germany (2024) Franchi N, Dressler F, Ergenc D, Guter P, Lassen V, Lübke M, Veihelmann CT, et al. Authored book It's Tee Time: An Ultrabroadband Componentless Bias Tee: A Planar Ultrabroadband Componentless Bias Tee in Microstrip Line Technology (2024) Kögel T, Scheder A, Meyl M, Sohr S, Vossiek M Journal article An Ultra-Wideband Microstrip Gain Equalizer on Thin-Film Ceramic for Future Millimeter Wave Applications up to and Beyond 120 GHz (2024) Scheder A, Pfahler T, Bridier A, Vossiek M Conference contribution A Foil Flip-Chip Interconnect With an Ultra-Broadband Bandwidth of 130 GHz and Beyond for Heterogeneous High-End System Designs (2024) Pfahler T, Scheder A, Bridier A, Nagel M, Vossiek M Journal article Investigation of a Simple and Versatile Concept for OFDM Radar Target Simulator Enhancement (2024) Birkenhauer C, Körner G, Stief P, Hamberger G, Beer M, Carlowitz C, Vossiek M Conference contribution, Conference Contribution Design, Fabrication and Broadband High-Resolution Characterization of a 415 GHz Rectangular Waveguide Bandpass Filter (2024) Müller S, Puppe T, Noack T, Wittmann M, Hechtfischer G, Vieweg N Conference contribution Full D-Band GaN Power Amplifier MMIC and Waveguide Module (2024) Cwiklinski M, Riedmann N, Ziegler R, Vossiek M, Bruckner P, Schwantuschke D, Mikulla M Conference contribution A MIMO ISAR Approach with Depth Camera Motion Tracking for Improved Imaging in Walk-Through Security Scanners (2023) Root K, Gumbmann F, Adametz J, Ullmann I, Vossiek M Conference contribution A Simple and Versatile Concept to Improve Dynamic Range and Enable Target Angle Adaptability in Radar Target Simulators (2023) Birkenhauer C, Körner G, Stief P, Hamberger G, Beer M, Carlowitz C, Vossiek M Journal article A Novel Ultra-Broadband Low-Loss Bond-Wire Interconnect Design Concept Applied to a 2 GHz to 135 GHz Substrate-to-Substrate Interface (2023) Pfahler T, Scheder A, Bridier A, Schür J, Vossiek M Conference contribution