Hochschule für Angewandte Wissenschaften Hof

University / College


Location: Hof, Germany (DE) DE

ISNI: 0000000405662839

ROR: https://ror.org/04q5vv384

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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

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To

Abstract

Journal

Evaluation of Mechanical Stress on Electronic Assemblies during Thermoforming and Injection Molding for Conformable Electronics (2021) Schirmer J, Reichenberger M, Wimmer A, Reichel H, Neermann S, Franke J Conference contribution Long-term electromigration study of lead-free flip-chips with solder bumps with 50 μm or 60 μm diameter employing ENIG surface finish on both chip and substrate side (2013) Gorywoda M, Dohle R, Härter S, Wirth A, Goßler J, Franke J Conference contribution
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