Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB)

Research facility


Location: Erlangen, Germany (DE) DE

ISNI: 0000000104810543

ROR: https://ror.org/04q5rka56

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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

From
To

Abstract

Journal

From devices to circuits: modelling the performance of 5nm nanosheets (2019) Brown AR, Wang L, Asenov P, Kluepfel FJ, Cheng B, Martinie S, Rozeau O, et al. Conference contribution Parylene Coatings in Power Electronic Modules (2019) Diepgen A, Zimmermann V, Bayer CF, Zhou Y, Forster C, Leib J, Schletz A, et al. Conference contribution, Conference Contribution Spatial and Temporal Temperature Homogenization in an Automotive Lithium-Ion Pouch Cell Battery Module (2019) Gepp M, Lorentz V, März M, Geffray F, Guyon E, Chopard F Conference contribution, Conference Contribution A Comprehensive Approach for Safety in DC-Microgrids (2019) Kaiser J, Strobl C, Mann H, Muhm H, Klimpel M, Schork F, März M Conference contribution, Conference Contribution A Cascaded Control Concept for Modular Multilevel Converters with Capacitor Voltage Estimation using a Kalman Filter (2019) Ruccius B, Kraus T, Westermann R, Heckel T, März M, Wagner B Conference contribution, Conference Contribution Improving 5V digital 4H-SIC CMOS ics for operating at 400°C using PMOS channel implantation (2019) Albrecht M, Erlbacher T, Bauer A, Frey L Journal article, Report Towards highly integrated, automotive power SoCs using capacitors operating at 100 V implemented in TSV (2019) Grünler S, Rattmann G, Erlbacher T, Bauer AJ, Krach F, Frey L Conference contribution Silicon RC-Snubber for 900 V Applications Utilising non-Stoichiometric Silicon Nitride (2019) Boettcher N, Heckel T, Erlbacher T, Pelaic K Conference contribution An isolated bidirectional half-bridge active-clamp current-fed push-pull DC/DC converter for DC microgrid applications (2019) Schulz M, Ditze S, Diller M, Han Y, März M Conference contribution, Conference Contribution Performance of 4H-SIC bipolar diodes as temperature sensor at low temperatures (2019) Di Benedetto L, Matthus C, Erlbacher T, Bauer AJ, Licciardo GD, Rubino A, Frey L Conference contribution