Vitesco Technologies GmbH

Algorithms for Weld Depth Measurement in Laser Welding of Copper with Scanning Optical Coherence Tomography (2022) Will T, Garcia EM, Hoelbling C, Goth C, Schmidt M Journal article In-Process Analysis of Melt Pool Fluctuations with Scanning Optical Coherence Tomography for Laser Welding of Copper for Quality Monitoring (2022) Will T, Jeron T, Hoelbling C, Mueller L, Schmidt M Journal article Location dependent down-rating of voids in high power solder connections for automotive power modules (2022) Ottinger B, Murk S, König S, Zangarro A, Müllmaier M, Müller L, Franke J Conference contribution Reliability assessment and thermal characterization of automotive power module package based on novel thick copper-ceramic substrate and hard epoxy encapsulation (2022) Sprenger M, Forndran F, Ottinger B, Braun T, Franke J Conference contribution, Conference Contribution Reliability of lead-free solders for die attach in automotive power modules (2022) Ottinger B, Holverscheid J, Konig S, Jerichow E, Lunz S, Sprenger M, Muller L, et al. Conference contribution Parametric study on relevant design and material parameters for reliable hard encapsulation of automotive power modules (2022) Sprenger M, Noll N, Hecht C, De Greiff M, Müller L, Franke J Conference contribution Feature extraction based on scalable hypothesis tests from photodiode data in laser welding processes (2022) Will T, Schwarzkopf K, Hölbling C, Müller L, Schmidt M Conference contribution Weld Classification with Feature Extraction by FRESH Algorithm based on Surface Topographical Optical Coherence Tomography Data for Laser Welding of Copper (2022) Will T, Kohl J, Burger S, Holbling C, Müller L, Schmidt M Journal article Fault Tolerance in Heterogeneous Automotive Real-time Systems (2022) Lex J, Margull U, Fey D, Mader R Conference contribution Hard encapsulation of automotive power modules by epoxy potting-encapsulant selection assisted by thermo-mechanical simulation (2022) Sprenger M, Forndran F, Ottinger B, Dammann T, Erben B, Sippel M, Franke J Conference contribution