Nils Thielen

Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)

Comparative Study on Different Methods to Generate Synthetic Data for the Classification of THT Solder Joints (2024) Thielen N, Rachinger B, Schröder F, Preitschaft A, Meier S, Seidel R, Reinhardt A, Franke J Conference contribution Implementation of a Camera System for the Application of Artificial Intelligence in Monitoring the Cold Atmospheric Plasma Spray Process (2024) Ockel M, Meier S, Stelter O, Thielen N, Bründl P, Franke J Conference contribution Optimizing Machine Learning Performance via Dataset Generation for X-ray Image Classification (2024) Mahr F, Schmidt K, Thielen N, Sindel T, Franke J Conference contribution Influences on the Mechanical Strength of Inkjet-Printed, Ag-Nanoparticle-Based Interconnects of Fine-Pitch Components (2024) Voigt C, Dornheim J, Muth A, Petersen M, Thielen N, Franke J Conference contribution A process model for systematically setting up the data basis for data-driven projects in manufacturing (2023) Meier S, Klarmann S, Thielen N, Pfefferer C, Kuhn M, Franke J Journal article Development and validation of a digital twin framework for SMT manufacturing (2023) Seidel R, Rachinger B, Thielen N, Schmidt K, Meier S, Franke J Journal article Anomaly Detection for Dispensing of Solder Paste on 3D Circuit Carriers Using Machine Learning (2023) Thielen N, Wagner M, Meier S, Voigt C, Franke J Conference contribution Analysis of the Suitability of Inkjet-Printed Ag-Particle-Filled Inks for Use in Connections of Fine-Pitch Electrical Components (2023) Voigt C, Petersen M, Thielen N, Utsch D, Häußler F, Kirchberger M, Franke J Conference contribution, Conference Contribution Attention-based Image Compression in Sensor Assembly (2022) Meier S, Erkan A, Thielen N, Klarmann S, Franke J Conference contribution Machine Learning Based Quality Prediction for Solder Paste Dispensing in Electronics Production (2022) Thielen N, Pan W, Piechulek N, Voigt C, Meier S, Schmidt K, Franke J Conference contribution