Tim Pfahler

Lehrstuhl für Hochfrequenztechnik (LHFT)

Printed Circuit Board Material Characterization at Millikelvin Temperatures for Cryogenic Microwave Circuit Design (2024) Zocher N, Pfahler T, Vossiek M, Carlowitz C Conference contribution Investigation of the Electromagnetic Wave-Tissue Interaction of a 75–110 GHz Reflective Resonator Probe for Tissue Classification (2024) Hecht D, Pfahler T, Vossiek M Conference contribution Compact 150 GHz and 300 GHz Dual-Band On-Chip Antenna for Future Communication and Sensing Applications (2024) Pfahler T, Schür J, Vossiek M Conference contribution An Ultra-Wideband Microstrip Gain Equalizer on Thin-Film Ceramic for Future Millimeter Wave Applications up to and Beyond 120 GHz (2024) Scheder A, Pfahler T, Bridier A, Vossiek M Conference contribution Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz (2024) Pfahler T, Breun S, Engel L, Geissler C, Schür J, Vossiek M Journal article 3D-Printed Dielectric Image Lines Towards Chip-to-Chip Interconnects for subTHz-Applications (2024) Hahn L, Pfahler T, Bader T, Gold G, Vossiek M, Carlowitz C Conference contribution Towards 3D-Printed Antenna in Package Solutions for THz-Applications (2024) Pfahler T, Gold G, Hofmann A, Schür J, Vossiek M Conference contribution A Foil Flip-Chip Interconnect With an Ultra-Broadband Bandwidth of 130 GHz and Beyond for Heterogeneous High-End System Designs (2024) Pfahler T, Scheder A, Bridier A, Nagel M, Vossiek M Journal article Design and Measurement Characterization of Two 300 GHz Fan-In Antennas in Package for Upcoming Sub-THz Applications (2024) Pfahler T, Vossiek M Conference contribution A Low-Loss Bond-Wire Interconnect Design With More Than 130 GHz Bandwidth Enabling an Ultra-Broadband Heterogeneous System Design (2023) Pfahler T, Scheder A, Bridier A, Schür J, Vossiek M Journal article