Third Party Funds Group - Sub project
Acronym: EXC 315/2
Start date : 01.11.2012
End date : 31.10.2017
The chair of electron devices develops electronic thin films from nanoparticles. Whereas particles can be synthesized in excellent materials quality at high temperatures, the low-temperature deposition of thin films allows for the integration with sensitive substrates as paper or polymer foils. Thus, novel bendable and large-area devices like displays or solar cells will be enabled in future.
The most important task with thin-film formation from nanoparticles is the control of electronic properties and the encapsulation against environmental impacts which both had been investigated in a prior phase of the project. In the current period, application-related issues like the influence of geometry on the current-voltage characteristics and the integration of devices into circuits are adressed.
Processing and physics of thin-film devices based on group-IV nanoparticles are in the focus of this project.
It has been shown in an earlier stage of the project that formulation, deposition, and thermal post treatment define the electrical behavior of silicon nanoparticle thin films. Dedicated passivation shemes have been developed for suppression of surface effects on the device characteristics.
In the current period the research is extended to germanium and SiGe alloys in different compositions. Special focus is laid on high-level device-related issues as the influence of geometry on electrical parameters, the optimization of metal-to-semiconductor contacts, and the integration of devices into functional latches . Photonic sintering for modification of inter-particle contacts is targeted additionally.