Proven Power Cycling Reliability of Ohmic Annealing Free SiC Power Device Through the Use of SmartSiC™ Substrate

Becker T (2023)

Publication Status: Published

Publication Type: Authored book, Volume of book series

Publication year: 2023

Publisher: Trans Tech Publications Ltd

Book Volume: 1092

Pages Range: 201-207

DOI: 10.4028/p-777hqg

Authors with CRIS profile

Tom Becker Lehrstuhl für Elektronische Bauelemente

How to cite

APA:

Becker, T. (2023). Proven Power Cycling Reliability of Ohmic Annealing Free SiC Power Device Through the Use of SmartSiC™ Substrate. Trans Tech Publications Ltd.

MLA:

Becker, Tom. Proven Power Cycling Reliability of Ohmic Annealing Free SiC Power Device Through the Use of SmartSiC™ Substrate. Trans Tech Publications Ltd, 2023.

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