Design and Measurement Characterization of Two 300 GHz Fan-In Antennas in Package for Upcoming Sub-THz Applications
Pfahler T, Vossiek M (2024)
Publication Type: Conference contribution
Publication year: 2024
Publisher: Institute of Electrical and Electronics Engineers Inc.
Pages Range: 804-807
Conference Proceedings Title: 2024 54th European Microwave Conference, EuMC 2024
Event location: Paris
ISBN: 9782874870774
DOI: 10.23919/EuMC61614.2024.10732180
Abstract
This paper presents the design and measurement characterization of two antennas in package (AiP) feeding concepts in the chip's fan-in wafer level ball grid array (WLB) at 300 GHz. The key advantage of the two designs is the vertical integration of the AiPs, directly above the integrated circuit (IC), instead of lateral antenna placement as in fan-out WLB. This minimizes the separation of package and IC components, resulting in minimal insertion loss (IL) at the IC to package transition. A probe-feed AiP, using a through-mold-via (TMV), and an electro-magnetic (EM) coupled AiP are presented and described in detail. Both AiPs are verified by measuring the return loss, the frequency-dependent antenna gain, and the radiation pattern. The measured -10 dB matching bandwidth of the probe-feed AiP and EM-coupled AiP is 36 GHz and 12 GHz, respectively. Furthermore, a laser scanning microscope was used to determine manufacturing tolerances and to account for deviations in the frequency response between measurement and simulation. A simulated antenna peak gain beyond 5.5 dBi emphasizes the underlying packaging approach to compensate for the free-space loss at 300 GHz for future sensing and communication systems in package applications.
Authors with CRIS profile
Tim Pfahler
Lehrstuhl für Hochfrequenztechnik (LHFT)
Martin Vossiek
Lehrstuhl für Hochfrequenztechnik (LHFT)
Additional Organisation(s)
How to cite
APA:
Pfahler, T., & Vossiek, M. (2024). Design and Measurement Characterization of Two 300 GHz Fan-In Antennas in Package for Upcoming Sub-THz Applications. In 2024 54th European Microwave Conference, EuMC 2024 (pp. 804-807). Paris, FR: Institute of Electrical and Electronics Engineers Inc..
MLA:
Pfahler, Tim, and Martin Vossiek. "Design and Measurement Characterization of Two 300 GHz Fan-In Antennas in Package for Upcoming Sub-THz Applications." Proceedings of the 54th European Microwave Conference, EuMC 2024, Paris Institute of Electrical and Electronics Engineers Inc., 2024. 804-807.
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