Dual Polarized 1-Bit Reconfigurable Reflective Unit Cell Design for Intelligent Reflective Surfaces Operating in the 5.8 GHz ISM Band

Scheder A, Fleischmann J, Gröschel P, Vossiek M (2024)

Publication Type: Conference contribution

Publication year: 2024

Publisher: Institute of Electrical and Electronics Engineers Inc.

Pages Range: 236-239

Conference Proceedings Title: 2024 54th European Microwave Conference, EuMC 2024

Event location: Paris

ISBN: 9782874870774

DOI: 10.23919/EuMC61614.2024.10732627

Abstract

In this paper the design, simulation and validation of a novel dual-polarized 1-bit reconfigurable reflective unit cell in the 5.8 GHz ISM Band used for intelligent reflective surfaces is presented. A unique feature of this design is the ability to change the phase shifts of a horizontally and a vertically polarized wave for each unit cell element separately. Therefore, it can also be used to change the direction of rotation of a circularly polarized wave. The unit cell is based on aperture-coupled patch antennas. In this design, the same patch is used for both receiving and retransmitting the signal with the corresponding phase shift. Moreover a measurement method for evaluating the performance of a reflective unit cell is presented. The simulation results show a 1-bit phase shift of 180 degrees and a low reflection losses of 0.5 dB and 1 dB of the two reflection states. The results also show a modulation efficiency of up to 90%.

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APA:

Scheder, A., Fleischmann, J., Gröschel, P., & Vossiek, M. (2024). Dual Polarized 1-Bit Reconfigurable Reflective Unit Cell Design for Intelligent Reflective Surfaces Operating in the 5.8 GHz ISM Band. In 2024 54th European Microwave Conference, EuMC 2024 (pp. 236-239). Paris, FR: Institute of Electrical and Electronics Engineers Inc..

MLA:

Scheder, André, et al. "Dual Polarized 1-Bit Reconfigurable Reflective Unit Cell Design for Intelligent Reflective Surfaces Operating in the 5.8 GHz ISM Band." Proceedings of the 54th European Microwave Conference, EuMC 2024, Paris Institute of Electrical and Electronics Engineers Inc., 2024. 236-239.

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