Loop Inductance Based RLCK Models of PCBs and IC-Packages in Practice
Schade A, Klotz F, Weigel R (2024)
Publication Type: Conference contribution
Publication year: 2024
Publisher: Institute of Electrical and Electronics Engineers Inc.
Conference Proceedings Title: 2024 14th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2024
Event location: Torino, ITA
ISBN: 9798331504632
DOI: 10.1109/EMCCompo61192.2024.10742032
Abstract
Loop inductances offer decisive advantages over partial inductances when electromagnetic systems shall be modeled in a compact and understandable manner. This publication builds on a previously published mathematical technique to extract physical “white-box” models from S-parameters of systems comprising, e.g., power IC metallization, interposers, IC-packages, PCBs and an environment. We shown how a complex system can be segmented by means of differential source and sink ports, forming a multigraph. The ports should be arranged in order to minimize the number of large magnetic couplings by reducing loop area and overlap. We discuss practical examples, such as striplines, half bridges, discrete coils and segmented ground planes. The technique supports development of CMOS SoCs, integrated Automotive ICs, fast-switching DC/DC-converters and high-power modules (SiC MOSFETs, GaN HEMTs).
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Germany (DE)How to cite
APA:
Schade, A., Klotz, F., & Weigel, R. (2024). Loop Inductance Based RLCK Models of PCBs and IC-Packages in Practice. In 2024 14th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2024. Torino, ITA: Institute of Electrical and Electronics Engineers Inc..
MLA:
Schade, Alexander, Frank Klotz, and Robert Weigel. "Loop Inductance Based RLCK Models of PCBs and IC-Packages in Practice." Proceedings of the 14th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2024, Torino, ITA Institute of Electrical and Electronics Engineers Inc., 2024.
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