Modelling Warpage Behavior of Molded Power Modules for Electric Vehicles

Forndran F, Sprenger M, Barrera JR, Steinau M, Roellig M, Muench S (2024)

Publication Type: Conference contribution

Publication year: 2024

Publisher: Institute of Electrical and Electronics Engineers Inc.

Conference Proceedings Title: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024

Event location: Catania IT

ISBN: 9798350393637

DOI: 10.1109/EuroSimE60745.2024.10491541

Abstract

Epoxy molding compounds play an increasingly important role in the packaging of automotive power modules, as they allow for size reduction of the modules and provide good insulation and protection properties. However, these hard-encapsulation materials strongly influence the thermo-mechanical properties of the power modules. In view of processability and reliability, especially the warpage is crucial. In this study, the (visco-)elastic properties of two different epoxy molding compound materials are characterized and implemented into finite element simulations. A Design of Experiment setup yields valuable results of the influence of different geometrical factors on the warpage. It is shown that especially the thicknesses of the substrate and the molding compound strongly influence the deformation behavior at low and high temperatures.

Authors with CRIS profile

Mario Sprenger Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS) Martin Steinau Technische Fakultät

Involved external institutions

Vitesco Technologies GmbH DE Germany (DE) Fraunhofer-Institut für Keramische Technologien und Systeme (IKTS) DE Germany (DE)

How to cite

APA:

Forndran, F., Sprenger, M., Barrera, J.R., Steinau, M., Roellig, M., & Muench, S. (2024). Modelling Warpage Behavior of Molded Power Modules for Electric Vehicles. In 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Catania, IT: Institute of Electrical and Electronics Engineers Inc..

MLA:

Forndran, Freerik, et al. "Modelling Warpage Behavior of Molded Power Modules for Electric Vehicles." Proceedings of the 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024, Catania Institute of Electrical and Electronics Engineers Inc., 2024.

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