Overcoming Challenges in Transparent Material Assembly: Advances of Ultra Short Pulse Laser Welding

Günther L, Thomas JU, Hermann J, Ohlinger A, Friedrich A, de Ligny D (2025)

Publication Type: Conference contribution

Publication year: 2025

Publisher: SPIE

Book Volume: 13353

Conference Proceedings Title: Proceedings of SPIE - The International Society for Optical Engineering

Event location: San Francisco, CA US

ISBN: 9781510684546

DOI: 10.1117/12.3042863

Abstract

Direct Ultra Short Pulse (USP) laser welding offers a method for joining glasses or transparent crystalline materials to metal, providing micro-scale processing and minimal thermal effects. We developed a wafer-based USP laser micro-bonding method that allows for larger sample sizes, offering increased processing speed, while maintaining the dimensional precision associated with this method. Furthermore, we demonstrate shear strengths exceeding 50 MPa, which constitutes a threefold increase compared to reported state of the art values. Our findings constitute a significant advancement of glass-to-metal joining by USP laser welding techniques, overcoming existing challenges and opening new possibilities and material combinations for future applications.

Authors with CRIS profile

Lukas Günther Professur für Werkstoffwissenschaften (Glas und Keramik) Dominique de Ligny Professur für Werkstoffwissenschaften (Glas und Keramik)

Involved external institutions

SCHOTT AG DE Germany (DE)

How to cite

APA:

Günther, L., Thomas, J.U., Hermann, J., Ohlinger, A., Friedrich, A., & de Ligny, D. (2025). Overcoming Challenges in Transparent Material Assembly: Advances of Ultra Short Pulse Laser Welding. In Peter R. Herman, Roberto Osellame, Adela Ben-Yakar (Eds.), Proceedings of SPIE - The International Society for Optical Engineering. San Francisco, CA, US: SPIE.

MLA:

Günther, Lukas, et al. "Overcoming Challenges in Transparent Material Assembly: Advances of Ultra Short Pulse Laser Welding." Proceedings of the Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XXV 2025, San Francisco, CA Ed. Peter R. Herman, Roberto Osellame, Adela Ben-Yakar, SPIE, 2025.

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