Mario Sprenger

Lehrstuhl für Werkstoffwissenschaften (Werkstoffkunde und Technologie der Metalle) (WTM) Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)

Testing and simulation of lifetime for wire bond interconnections with varying bond foot angle (2024) Sippel M, Tan YF, Schmidt R, Botazzoli P, Sprenger M, Franke J Journal article Influence of hard encapsulation onto reliability of soldered die-attach in power modules (2024) Sprenger M, Forndran F, Öztürk B, Sippel M, Ockel M, Goth C, Franke J Conference contribution Modelling Warpage Behavior of Molded Power Modules for Electric Vehicles (2024) Forndran F, Sprenger M, Barrera JR, Steinau M, Roellig M, Muench S Conference contribution Additive metallization of alumina with copper-titanium powder blends for power electronic applications (2023) Hecht C, Häußler F, Schadow E, Stoll T, Sprenger M, Franke J Journal article Reliability of Piezojet-Printed Conductive Lines on Alumina Substrates Produced by Fused Filament Fabrication (2023) Utsch D, Häußler F, Sprenger M, Zirn J, Franke J Conference contribution Additive Metallization of Alumina with Copper-Titanium Powder Blends for Power Electronic Applications (2023) Hecht C, Schadow E, Sprenger M, Häußler F, Stoll T, Franke J Conference contribution, Conference Contribution Warpage of transfer-molded automotive power modules - experimental characterization, numerical simulation and optimization (2023) Sprenger M, Kramer M, Tolyschew E, Steinau M, Renner D, Ottinger B, Franke J Conference contribution Influence of the Bond Foot Angle on Active Power Cycling Lifetime of Wire Bonds (2023) Sippel M, Tan YF, Schmidt R, Botazzoli P, Sprenger M, Franke J Conference contribution High Temperature Die Attach: Study and Power Cycling of Direct-Bonded Silver Joints (2022) Häußler F, Sippel M, Sprenger M, Liu L, Muckelbauer M, Franke J Conference contribution Reliability assessment and thermal characterization of automotive power module package based on novel thick copper-ceramic substrate and hard epoxy encapsulation (2022) Sprenger M, Forndran F, Ottinger B, Braun T, Franke J Conference contribution, Conference Contribution