Mario Sprenger



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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

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To

Abstract

Journal

Influence of Current Density on Wire Bond Lifetime in Active Power Cycling Test (2022) Sippel M, Schmidt R, Kaesbauer M, Sprenger M, Hensel A, Franke J Conference contribution Reliability of lead-free solders for die attach in automotive power modules (2022) Ottinger B, Holverscheid J, Konig S, Jerichow E, Lunz S, Sprenger M, Muller L, et al. Conference contribution Parametric study on relevant design and material parameters for reliable hard encapsulation of automotive power modules (2022) Sprenger M, Noll N, Hecht C, De Greiff M, Müller L, Franke J Conference contribution Laser Cleaning of Flux Residues on Copper Surfaces in Electronics Production (2022) Hecht C, Slama JN, Sprenger M, Haubler F, Sippel M, Franke J Conference contribution Impact of Aluminum Metallization Reconstruction on the Current Distribution in Power Semiconductors (2022) Sippel M, Hassel S, Schmidt R, Sprenger M, Hecht C, Franke J Conference contribution Hard encapsulation of automotive power modules by epoxy potting-encapsulant selection assisted by thermo-mechanical simulation (2022) Sprenger M, Forndran F, Ottinger B, Dammann T, Erben B, Sippel M, Franke J Conference contribution MultOpt++: a fast regression-based model for the development of compositions with high robustness against scatter of element concentrations (2019) Müller A, Roslyakova I, Sprenger M, Git P, Rettig R, Markl M, Körner C, Singer R Journal article MultOpt++: a fast regression-based model for the constraint violation fraction due to composition uncertainties (2019) Müller A, Sprenger M, Ritter N, Rettig R, Markl M, Körner C, Singer R Journal article